High Precision Aluminum Nitride DPC Ceramic SubstrateProduct Specifications: Material: Aluminum Nitride Ceramic Thickness: 0.38 mm Graphic Tolerance: ±0.03 mm Product Size: 109.2×54.5 mm Tolerance: ±0.05 Warp: 0.003 mm/mm Key Highlights: Direct Plating Copper technology ensures high-precision graphic patterns and vertical circuit interconnections, ideal for dense packaging in optical communication devices; Exceptional thermal conductivity aids rapid …

High Thermal Conductivity Aluminum Nitride DPC Ceramic SubstrateProduct Specifications: Material: Aluminum Nitride Ceramic Thickness: 0.38 mm Graphic Tolerance: ±0.03 mm Product Size: 109.2×54.5 mm Tolerance: ±0.05 Warp: 0.003 mm/mm Key Features: Ceramic thermal conductivity exceeds 170, ensuring excellent heat transfer and rapid heat dissipation for stable operating temperatures; Manufactured with Direct Plating Copper technology, offering …

High-Reliability DBC Ceramic Substrate for Packaging Product Specifications: Material: Alumina ceramic / ZTA Thickness: 0.32 / 0.635 mm Graphic Tolerance: ±0.03 mm Product Size: 109.2×54.5 mm Peel Strength: >5 N/mm Insulation Strength: >15K Product Advantages: Employs advanced direct bonding copper technology to ensure a seamless union between copper and ceramic, delivering outstanding durability and stability. …

Product Specifications: Material: Alumina ceramic / ZTA Thickness: 0.32 / 0.635 mm Graphic Tolerance: ±0.03 mm Product Size: 109.2×54.5 mm Peel Strength: >5 N/mm Insulation Strength: >15K Key Features: Utilizes direct bonding copper technology to achieve a robust chemical bond between copper and ceramic, thereby enhancing thermal conductivity and structural stability. Alumina ceramic offers high …

    SiC Power Device Fabrication Process Flow ‌   1. Substrate Preparation‌ ‌Core Objective‌: Obtain high-purity, low-defect SiC single-crystal substrates. ‌Crystal Growth‌: SiC powder is sublimated and deposited on a seed crystal via the Physical Vapor Transport (PVT) method at >2000°C, forming a SiC ingot‌. ‌Wafer Processing‌: Cutting: Diamond wire saws slice the ingot …

AMB Precision Ceramic Customization: High-Performance Materials, Tailored Solutions   In the realms of high technology and precision engineering, material selection is critical. AMB (Active Metal Brazing) ceramics stand out as high-performance materials, renowned for their exceptional thermal conductivity, electrical insulation, and mechanical strength, making them a preferred choice for numerous advanced applications. Our AMB precision …

  DBC Ceramic Customization: Superior Performance, Tailored Solutions   In the realms of high technology and precision engineering, material selection is critical. DBC (Direct Bonded Copper) ceramics stand out as a high-performance material, renowned for their exceptional thermal conductivity, electrical insulation, and mechanical strength, making them a preferred choice for numerous advanced applications. Our DBC …

AMB Ceramic Metallized Substrate Product Introduction （Active Metal Brazing Ceramic Substrate）   In today’s rapidly evolving electronics industry, high-performance and high-reliability electronic components and materials are crucial for driving technological innovation and product upgrades. AMB (Active Metal Brazing) ceramic metallized substrates, as an advanced electronic packaging material, are demonstrating immense potential in sectors such as …

DBC ceramic substrate Direct Bonding Copper Material: Alumina ceramic/ZTA Thickness: 0.32/0.635 Graphic tolerance: ±0.03 Product size: 109.2*54.5mm Peel strength:>5N/mm Insulation strength:>15K Features: Copper and ceramic are chemically bonded, and have the characteristics of high thermal conductivity, high insulation, high mechanical strength, and low expansion of alumina ceramics. It also has the high conductivity and excellent …

Alumina DPC ceramic substrate Direct Plating Copper Material: Alumina ceramic Thickness: 0.5 Graphic tolerance: ±0.03 Product size: 109.2*54.5mm Tolerance: ±0.05 Warp (mm): 0.003/mm Features: Ceramic thermal conductivity>24, with high line accuracy, high surface flatness, high insulation and high thermal conductivity, low thermal expansion coefficient, circuits can be vertically interconnected LED, laser, optical communication, laser radar

Aluminum nitride ceramic DPC ceramic substrate Direct Plating Copper Material: aluminum nitride ceramic Thickness: 0.38 Graphic tolerance: ±0.03 Product size: 109.2*54.5mm Tolerance: ±0.05 Warp (mm): 0.003/mm Features: Ceramic thermal conductivity>170, with good thermal conductivity/heat resistance, high graphic accuracy, vertical circuit interconnection and other technical advantages, high electrical insulation, close to the thermal expansion coefficient of …

 Customized just for you Our company supports personalized customization of ceramic products Advantages/characteristics of ceramic structures 1. High-precision and ultra-high-precision processing technology 2. Various ceramic material systems such as zirconium oxide, aluminum oxide, aluminum nitride, silicon carbide, etc. 3. In-depth development of composite materials based on ceramics, metals, and plastic materials to meet higher demands …