Aluminum nitride ceramic DPC ceramic substrate（Direct Plating Copper）

Aluminum nitride ceramic DPC ceramic substrate Direct Plating Copper Material: aluminum nitride ceramic Thickness: 0.38 Toleranță grafică: ±0.03 Dimensiunea produsului: 109.2*54.5mm Tolerance: ±0.05 Warp (milimetru): 0.003/mm Features: Ceramic thermal conductivity>170, with good thermal conductivity/heat resistance, high graphic accuracy, vertical circuit interconnection and other technical advantages, high electrical insulation, close to the thermal expansion coefficient of silicon Application areas: LED, laser, optical communication, laser radar

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Detalii produs

Aluminum nitride ceramic DPC ceramic substrate
Direct Plating Copper

Material: aluminum nitride ceramic
Grosime: 0.38
Toleranță grafică: ±0,03
Dimensiunea produsului: 109.2*54.5milimetru
Tolerance: ±0.05
Warp (milimetru): 0.003/milimetru
Caracteristici: Ceramic thermal conductivity>170, with good thermal conductivity/heat resistance, high graphic accuracy, vertical circuit interconnection and other technical advantages, high electrical insulation, close to the thermal expansion coefficient of silicon
Domenii de aplicare: LED, laser, optical communication, laser radar