SiC Schottky Diodes – High Efficiency & Reliability Product Overview Our SiC Schottky Diodes offer a voltage range of 650V to 1200V with a full current spectrum, delivering industry-leading performance. Recognized at an international level, our diodes are now being mass-produced and widely adopted in China. Key Features ✅ Positive Temperature Coefficient – Enables easy …

SiC MOSFET Series Product introduction Successfully developed a series of SiC MOS products under the 1200Vvoltage platform,the performance of which has reached the interna-tional level, and has been suppling in batches. Product features High blocking voltage, ultra-low on-resistance, low capacitance and high-speed switching, less affected by switching loss temperature, extremely low internal reverse recovery charge, …

  SiC Power Device Fabrication Process Flow ‌ 1. Substrate Preparation‌ ‌Core Objective‌: Obtain high-purity, low-defect SiC single-crystal substrates. ‌Crystal Growth‌: SiC powder is sublimated and deposited on a seed crystal via the Physical Vapor Transport (PVT) method at >2000°C, forming a SiC ingot‌. ‌Wafer Processing‌: Cutting: Diamond wire saws slice the ingot into wafers …

AMB Precision Ceramic Customization: High-Performance Materials, Tailored Solutions In the realms of high technology and precision engineering, material selection is critical. AMB (Active Metal Brazing) ceramics stand out as high-performance materials, renowned for their exceptional thermal conductivity, electrical insulation, and mechanical strength, making them a preferred choice for numerous advanced applications. Our AMB precision ceramic …

  DBC Ceramic Customization: Superior Performance, Tailored Solutions   In the realms of high technology and precision engineering, material selection is critical. DBC (Direct Bonded Copper) ceramics stand out as a high-performance material, renowned for their exceptional thermal conductivity, electrical insulation, and mechanical strength, making them a preferred choice for numerous advanced applications. Our DBC …

AMB Ceramic Metallized Substrate Product Introduction （Active Metal Brazing Ceramic Substrate）   In today’s rapidly evolving electronics industry, high-performance and high-reliability electronic components and materials are crucial for driving technological innovation and product upgrades. AMB (Active Metal Brazing) ceramic metallized substrates, as an advanced electronic packaging material, are demonstrating immense potential in sectors such as …

DBC ceramic substrate Direct Bonding Copper Material: Alumina ceramic/ZTA Thickness: 0.32/0.635 Graphic tolerance: ±0.03 Product size: 109.2*54.5mm Peel strength:>5N/mm Insulation strength:>15K Features: Copper and ceramic are chemically bonded, and have the characteristics of high thermal conductivity, high insulation, high mechanical strength, and low expansion of alumina ceramics. It also has the high conductivity and excellent …

Alumina DPC ceramic substrate Direct Plating Copper Material: Alumina ceramic Thickness: 0.5 Graphic tolerance: ±0.03 Product size: 109.2*54.5mm Tolerance: ±0.05 Warp (mm): 0.003/mm Features: Ceramic thermal conductivity>24, with high line accuracy, high surface flatness, high insulation and high thermal conductivity, low thermal expansion coefficient, circuits can be vertically interconnected LED, laser, optical communication, laser radar

Aluminum nitride ceramic DPC ceramic substrate Direct Plating Copper Material: aluminum nitride ceramic Thickness: 0.38 Graphic tolerance: ±0.03 Product size: 109.2*54.5mm Tolerance: ±0.05 Warp (mm): 0.003/mm Features: Ceramic thermal conductivity>170, with good thermal conductivity/heat resistance, high graphic accuracy, vertical circuit interconnection and other technical advantages, high electrical insulation, close to the thermal expansion coefficient of …

 Customized just for you Our company supports personalized customization of ceramic products Advantages/characteristics of ceramic structures 1. High-precision and ultra-high-precision processing technology 2. Various ceramic material systems such as zirconium oxide, aluminum oxide, aluminum nitride, silicon carbide, etc. 3. In-depth development of composite materials based on ceramics, metals, and plastic materials to meet higher demands …

Advantages/characteristics of ceramic structures 1. High-precision and ultra-high-precision processing technology 2. Various ceramic material systems such as zirconium oxide, aluminum oxide, aluminum nitride, silicon carbide, etc. 3. In-depth development of composite materials based on ceramics, metals, and plastic materials to meet higher demands 4. The industry’s first tape casting to prepare multi-layer composite components 5. …

High Thermal Conductivity LED Substrate LED aluminum nitride gold-plated substrate： using DPC process to electroplate the conductive line on the aluminum nitride substrate, the coating is Ti-Cu-Ni-Pd-Au, with excellent conductivity and heat dissipation, used in LED chip packaging. LED aluminum oxide silver-plated substrate： using DPC process to electroplate the conductive line on the aluminum oxide …