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  4. DBC Ceramic Substrate – Direct Bonding Copper Technology
DBC Ceramic Substrate – Direct Bonding Copper Technology

DBC Ceramic Substrate – Direct Bonding Copper Technology

Product Specifications: 재료: 알루미나 세라믹 / ZTA Thickness: 0.32 / 0.635 mm Graphic Tolerance: ±0.03 mm Product Size: 109.2×54.5 mm Peel Strength: >5 N/mm Insulation Strength: >15K Key Features: Utilizes direct bonding copper technology to achieve a robust chemical bond between copper and ceramic, thereby enhancing thermal conductivity and structural stability. Alumina ceramic offers high thermal conductivity, 우수한 절연성, 높은 기계적 강도, and a low thermal expansion coefficient. Coupled with the superior conductivity and welding performance of oxygen-free copper, it allows precise etching of PCB graphics and exceptional current carrying capacity. Designed for semiconductor packaging and IGBT modules, this product excels in aerospace, communication cooling systems, industrial control, as well as emerging applications in new energy vehicles and photovoltaic power…

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Product Specifications:

      • 재료: 알루미나 세라믹 / ZTA

      • 두께: 0.32 / 0.635 밀리미터

      • Graphic Tolerance: ±0.03 mm

      • Product Size: 109.2×54.5 mm

      • Peel Strength: >5 N / 밀리미터

      • Insulation Strength: >15K

Key Features:

      • Utilizes direct bonding copper technology to achieve a robust chemical bond between copper and ceramic, thereby enhancing thermal conductivity and structural stability.

      • Alumina ceramic offers high thermal conductivity, 우수한 절연성, 높은 기계적 강도, and a low thermal expansion coefficient. Coupled with the superior conductivity and welding performance of oxygen-free copper, it allows precise etching of PCB graphics and exceptional current carrying capacity.

      • Designed for semiconductor packaging and IGBT modules, this product excels in aerospace, communication cooling systems, industrial control, as well as emerging applications in new energy vehicles and photovoltaic power generation.

Application Areas:

      • Semiconductor cooling components, aerospace equipment, and communication heat dissipation systems

      • High-speed rail, 신에너지 자동차, photovoltaic power, and industrial control

Keywords: DBC 세라믹 기판, 다이렉트 본딩 구리, alumina ceramic, ZTA, PCB etching, semiconductor packaging, 높은 열전도율, 높은 절연성

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