약 접촉 |

구성 요소/고급 세라믹 제품/

  1. 집
  2. 제품
  3. 고급 세라믹 제품
  4. 높은 열전도율 LED 기판
높은 열전도율 LED 기판

높은 열전도율 LED 기판

High Thermal Conductivity LED Substrate LED aluminum nitride gold-plated substrate： using DPC process to electroplate the conductive line on the aluminum nitride substrate, the coating is Ti-Cu-Ni-Pd-Au, with excellent conductivity and heat dissipation, used in LED chip packaging. LED aluminum oxide silver-plated substrate： using DPC process to electroplate the conductive line on the aluminum oxide substrate, the coating is Ti-Cu-Ag, with excellent conductivity and heat dissipation, used in LED chip packaging.

문의 보내기 라이브 채팅

높은 열전도율 LED 기판

LED aluminum nitride gold-plated substrate：

using DPC process to electroplate the conductive line on the aluminum nitride substrate,

the coating is Ti-Cu-Ni-Pd-Au, with excellent conductivity and heat dissipation, used in LED chip packaging.

LED aluminum oxide silver-plated substrate：

using DPC process to electroplate the conductive line on the aluminum oxide substrate,

the coating is Ti-Cu-Ag, with excellent conductivity and heat dissipation, used in LED chip packaging.

이전:

다음:

핫 제품

답을 남겨주세요