Керамическая подложка из нитрида алюминия DPC с высокой теплопроводностью

Керамическая подложка из нитрида алюминия DPC с высокой теплопроводностью
Product Specifications:

• • • Материал: Aluminum Nitride Ceramic

    • Толщина: 0.38 миллиметр

    • Graphic Tolerance: ±0.03 mm

    • Product Size: 109.2×54.5 mm

    • Толерантность: ±0,05

    • Основа: 0.003 mm/mm

Ключевые особенности:

• • • Ceramic thermal conductivity exceeds 170, ensuring excellent heat transfer and rapid heat dissipation for stable operating temperatures;

    • Manufactured with Direct Plating Copper technology, offering precise circuit patterns and vertical interconnections;

    • High electrical insulation and a thermal expansion coefficient closely matching that of silicon enhance overall system reliability.

Application Areas:

• • • LED lighting and display devices

    • Laser systems and optical communication equipment

    • Laser radar and high-temperature applications

Keywords: Aluminum Nitride Ceramic Substrate, DPC Substrate, Прямое покрытие из меди, high thermal conductivity, LED substrate, laser substrate