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Высоконадежная керамическая подложка DBC для упаковки

Высоконадежная керамическая подложка DBC для упаковки

High-Reliability DBC Ceramic Substrate for Packaging Product Specifications: Материал: Глиноземная керамика / ZTA Thickness: 0.32 / 0.635 mm Graphic Tolerance: ±0.03 mm Product Size: 109.2×54.5 mm Peel Strength: >5 N/mm Insulation Strength: >15K Product Advantages: Employs advanced direct bonding copper technology to ensure a seamless union between copper and ceramic, delivering outstanding durability and stability. Superior material properties of alumina and ZTA offer excellent resistance against thermal shock, making the substrate ideal for harsh operational environments. Widely used in high-reliability semiconductor packaging, IGBT modules, and other critical electronic components. Application Areas: Industrial automation, aerospace, and communication devices High-speed rail and new energy vehicle systems Keywords: DBC packaging substrate, high reliability, thermal shock resistance, industrial electronics, copper-ceramic bonding, IGBT module

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Высоконадежная керамическая подложка DBC для упаковки


Product Specifications:

      • Материал: Глиноземная керамика / ZTA

      • Толщина: 0.32 / 0.635 миллиметр

      • Graphic Tolerance: ±0.03 mm

      • Product Size: 109.2×54.5 mm

      • Peel Strength: >5 Н/мм

      • Insulation Strength: >15K

Product Advantages:

      • Employs advanced direct bonding copper technology to ensure a seamless union between copper and ceramic, delivering outstanding durability and stability.

      • Superior material properties of alumina and ZTA offer excellent resistance against thermal shock, making the substrate ideal for harsh operational environments.

      • Widely used in high-reliability semiconductor packaging, IGBT modules, and other critical electronic components.

Application Areas:

      • Industrial automation, aerospace, и устройства связи

      • High-speed rail and new energy vehicle systems

Keywords: DBC packaging substrate, high reliability, thermal shock resistance, industrial electronics, copper-ceramic bonding, IGBT module

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