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Керамическая подложка DBC – технология прямого склеивания меди

Керамическая подложка DBC – технология прямого склеивания меди

Product Specifications: Материал: Глиноземная керамика / ZTA Thickness: 0.32 / 0.635 mm Graphic Tolerance: ±0.03 mm Product Size: 109.2×54.5 mm Peel Strength: >5 N/mm Insulation Strength: >15K Key Features: Utilizes direct bonding copper technology to achieve a robust chemical bond between copper and ceramic, thereby enhancing thermal conductivity and structural stability. Alumina ceramic offers high thermal conductivity, excellent insulation, высокая механическая прочность, and a low thermal expansion coefficient. Coupled with the superior conductivity and welding performance of oxygen-free copper, it allows precise etching of PCB graphics and exceptional current carrying capacity. Designed for semiconductor packaging and IGBT modules, this product excels in aerospace, communication cooling systems, industrial control, as well as emerging applications in new energy vehicles and photovoltaic power…

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Product Specifications:

      • Материал: Глиноземная керамика / ZTA

      • Толщина: 0.32 / 0.635 миллиметр

      • Graphic Tolerance: ±0.03 mm

      • Product Size: 109.2×54.5 mm

      • Peel Strength: >5 Н/мм

      • Insulation Strength: >15K

Ключевые особенности:

      • Utilizes direct bonding copper technology to achieve a robust chemical bond between copper and ceramic, thereby enhancing thermal conductivity and structural stability.

      • Alumina ceramic offers high thermal conductivity, excellent insulation, высокая механическая прочность, and a low thermal expansion coefficient. Coupled with the superior conductivity and welding performance of oxygen-free copper, it allows precise etching of PCB graphics and exceptional current carrying capacity.

      • Designed for semiconductor packaging and IGBT modules, this product excels in aerospace, communication cooling systems, industrial control, as well as emerging applications in new energy vehicles and photovoltaic power generation.

Application Areas:

      • Semiconductor cooling components, aerospace equipment, and communication heat dissipation systems

      • High-speed rail, Транспортные средства на новых источниках энергии, photovoltaic power, and industrial control

Keywords: Керамическая подложка DBC, Медь с прямым соединением, alumina ceramic, ZTA, PCB etching, semiconductor packaging, high thermal conductivity, высокая теплоизоляция

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