High Performance Semiconductor Beryllium Beo Ceramic Disc Plate High Performance BeO Ceramic Plate with Excellent Thermal Conductivity for Semiconductor & Electronic Devices Beryllium Oxide Ceramic Beryllium oxide (BeO) ceramic is a high-performance advanced material known for its exceptional thermal conductivity and stability at high temperatures. It has a melting point ranging from 2530°C to 2570°C …

Al2O3 Ceramic Piston and Plunger Set – High Strength & Chemical Resistance for Pumps Wear and Corrosion Resistant Al2o3 Alumina Ceramic Piston Plunger Bushing Rod for High Pressure Pump Features of ceramic: 1. Refractory, High Temperature Resistance, Maximum Used Temperature: 1800 ºC (3272ºF)… 2. Hardness Strength Up To Mohs 9.0; HRA 80-90, Wear Resistance wear …

High-Purity Alumina Ceramic Disc for 1/2″–3/4″ Brass Tap Cartridges and Valves – Wear Resistant Attributes Details Material Alumina Ceramic (Alumina ceramics，95%–99%) Place of Origin Guangdong, China Type Ceramic Parts Application Industrial Ceramic / Valve Core / Tap Ceramic Disc Model Number XTL Brand Name GIM Processing Service Punching / OEM Service Available Color Pure …

Customized High Thermal Conductivity Aluminum Nitride (AlN) Ceramic Substrate Product Highlights Aluminum nitride (AlN) ceramic substrate is a next-generation material known for its exceptional thermal conductivity and excellent insulation properties. With the rising demand for efficient thermal management in high-power and high-density electronic applications, AlN has become a preferred choice for advanced LED packaging, large-scale …

Direct Bonded Copper (DBC) Alumina Ceramic Substrate Product Description Warning/Disclaimer This product has obtained relevant product qualifications/licenses for certain applicable countries. Products Description DBC ceramic substrate DBC ceramic substrate is a high-performance material used in power electronics. It combines direct bonded copper (DBC) with a ceramic base, offering excellent thermal conductivity and electrical insulation. This …

High Precision Aluminum Nitride DPC Ceramic SubstrateProduct Specifications: Материал: Aluminum Nitride Ceramic Thickness: 0.38 mm Graphic Tolerance: ±0.03 mm Product Size: 109.2×54.5 mm Tolerance: ±0.05 Деформация: 0.003 mm/mm Key Highlights: Direct Plating Copper technology ensures high-precision graphic patterns and vertical circuit interconnections, ideal for dense packaging in optical communication devices; Exceptional thermal conductivity aids rapid …

AlN DPC Ceramic Substrate with High Thermal Conductivity Product Specifications: Материал: Aluminum Nitride Ceramic Thickness: 0.38 mm Graphic Tolerance: ±0.03 mm Product Size: 109.2×54.5 mm Tolerance: ±0.05 Деформация: 0.003 mm/mm Key Features: Ceramic thermal conductivity exceeds 170, ensuring excellent heat transfer and rapid heat dissipation for stable operating temperatures; Manufactured with Direct Plating Copper technology, …

High-Reliability DBC Ceramic Substrate for Packaging Product Specifications: Материал: Глиноземная керамика / ZTA Thickness: 0.32 / 0.635 mm Graphic Tolerance: ±0.03 mm Product Size: 109.2×54.5 mm Peel Strength: >5 N/mm Insulation Strength: >15K Product Advantages: Employs advanced direct bonding copper technology to ensure a seamless union between copper and ceramic, delivering outstanding durability and stability. …

Direct Bonded Copper (DBC) Ceramic Substrate Product Specifications: Материал: Глиноземная керамика / ZTA Thickness: 0.32 / 0.635 mm Graphic Tolerance: ±0.03 mm Product Size: 109.2×54.5 mm Peel Strength: >5 N/mm Insulation Strength: >15K Key Features: Utilizes direct bonding copper technology to achieve a robust chemical bond between copper and ceramic, thereby enhancing thermal conductivity and …

Драйверы IGBT – высокая эффективность, Intelligent Control Plug & Play · Wide Compatibility · Comprehensive Protection Our plug-and-play IGBT drivers are designed for seamless integration with various high-power and high-voltage IGBT modules. Whether for standard or custom power module packages, we provide tailor-made driving solutions to meet diverse application needs. Key Features ✅ Plug & …

Модули FRD/SBD – высокоэффективная ректификация, Стабильная и надежная устойчивость к высокому напряжению · Низкий ток утечки · Низкое сопротивление · Высоковольтная емкость FRD (Быстрый восстановительный диод) и SBD (Барьерный диод Шоттки) Модули обеспечивают высокую устойчивость к напряжению, низкий ток утечки, низкое поступательное сопротивление, и высокая пропускная способность, что делает их незаменимыми для коммутации источников питания, PWM pulse …

Модули SiC MOSFET — высокопроизводительные силовые решения из карбида кремния с повышенной эффективностью · Снижение потерь · Превосходная надежность: Наши силовые модули на основе карбида кремния промышленного и автомобильного класса 650-1700 В предназначены для высокоэффективного преобразования энергии, Широко используется в возобновляемых источниках энергии, Интеллектуальные сети, Электромобилей (Электромобили), Промышленная автоматизация, и многое другое. Основные преимущества ✅ Конструкция корпуса с низкой индуктивностью – повышение коммутационных характеристик, …