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Substrato Cerâmico DBC - Tecnologia de Cobre de Ligação Direta

Substrato Cerâmico DBC - Tecnologia de Cobre de Ligação Direta

Especificações do produto: Material: Cerâmica de alumina / Espessura ZTA: 0.32 / 0.635 mm Tolerância gráfica: ±0,03 mm Tamanho do produto: 109.2×54,5 mm Resistência ao descascamento: >5 Força de isolamento N / mm: >15K Key Features: Utilizes direct bonding copper technology to achieve a robust chemical bond between copper and ceramic, thereby enhancing thermal conductivity and structural stability. Alumina ceramic offers high thermal conductivity, excellent insulation, high mechanical strength, and a low thermal expansion coefficient. Coupled with the superior conductivity and welding performance of oxygen-free copper, it allows precise etching of PCB graphics and exceptional current carrying capacity. Designed for semiconductor packaging and IGBT modules, this product excels in aerospace, communication cooling systems, industrial control, as well as emerging applications in new energy vehicles and photovoltaic power…

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Especificações do produto:

      • Material: Cerâmica de alumina / ZTA

      • Espessura: 0.32 / 0.635 milímetro

      • Tolerância gráfica: ±0,03 milímetros

      • Tamanho do produto: 109.2×54,5 milímetros

      • Força de casca: >5 N/mm

      • Força de isolamento: >15K

Características principais:

      • Utilizes direct bonding copper technology to achieve a robust chemical bond between copper and ceramic, thereby enhancing thermal conductivity and structural stability.

      • Alumina ceramic offers high thermal conductivity, excellent insulation, high mechanical strength, and a low thermal expansion coefficient. Coupled with the superior conductivity and welding performance of oxygen-free copper, it allows precise etching of PCB graphics and exceptional current carrying capacity.

      • Designed for semiconductor packaging and IGBT modules, this product excels in aerospace, communication cooling systems, industrial control, as well as emerging applications in new energy vehicles and photovoltaic power generation.

Áreas de aplicação:

      • Semiconductor cooling components, aerospace equipment, and communication heat dissipation systems

      • High-speed rail, new energy vehicles, photovoltaic power, and industrial control

Keywords: Substrato cerâmico DBC, Direct Bonding Copper, alumina ceramic, ZTA, PCB etching, semiconductor packaging, high thermal conductivity, high insulation

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