Aluminum nitride ceramic DPC ceramic substrate（Direct Plating Copper）

Aluminum nitride ceramic DPC ceramic substrate Direct Plating Copper Material: aluminum nitride ceramic Thickness: 0.38 Graphic tolerance: ±0.03 Product size: 109.2*54.5mm Tolerance: ±0.05 Warp (ミリメートル): 0.003/mm Features: Ceramic thermal conductivity>170, with good thermal conductivity/heat resistance, high graphic accuracy, vertical circuit interconnection and other technical advantages, high electrical insulation, close to the thermal expansion coefficient of silicon Application areas: LED, laser, optical communication, laser radar

お問い合わせを送信ライブチャット

製品概要

窒化アルミニウムセラミックDPCセラミック基板
Direct Plating Copper

Material: aluminum nitride ceramic
Thickness: 0.38
Graphic tolerance: ±0.03
Product size: 109.2*54.5ミリメートル
Tolerance: ±0.05
Warp (ミリメートル): 0.003/ミリメートル
Features: Ceramic thermal conductivity>170, with good thermal conductivity/heat resistance, high graphic accuracy, vertical circuit interconnection and other technical advantages, high electrical insulation, close to the thermal expansion coefficient of silicon
Application areas: LED, laser, optical communication, laser radar