Aluminum nitride ceramic DPC ceramic substrate（Direct Plating Copper）

Aluminum nitride ceramic DPC ceramic substrate Direct Plating Copper Material: aluminum nitride ceramic Thickness: 0.38 Graphic tolerance: ±0.03 Product size: 109.2*54.5mm Tolerance: ±0.05 Warp (mm): 0.003/mm Features: Ceramic thermal conductivity>170, with good thermal conductivity/heat resistance, high graphic accuracy, vertical circuit interconnection and other technical advantages, high electrical insulation, close to the thermal expansion coefficient of silicon Application areas: LED, laser, optical communication, laser radar

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Dettagli del prodotto

Aluminum nitride ceramic DPC ceramic substrate
Direct Plating Copper

Material: aluminum nitride ceramic
Thickness: 0.38
Graphic tolerance: ±0.03
Product size: 109.2*54.5mm
Tolerance: ±0.05
Warp (mm): 0.003/mm
Tratti somatici: Ceramic thermal conductivity>170, with good thermal conductivity/heat resistance, high graphic accuracy, vertical circuit interconnection and other technical advantages, high electrical insulation, close to the thermal expansion coefficient of silicon
Application areas: LED, laser, optical communication, laser radar