If you have questions about our products, Fill out the form below and we will answer any questions you have. Tips: Fields marked with*are required. High Thermal Conductivity Aluminum Nitride DPC Ceramic SubstrateHigh Thermal Conductivity Aluminum Nitride DPC Ceramic SubstrateProduct Specifications: Material: Aluminum Nitride Ceramic Thickness: 0.38 mm Graphic Tolerance: ±0.03 mm Product Size: 109.2×54.5 mm Tolerance: ±0.05 Warp: 0.003 mm/mm Key Features: Ceramic thermal conductivity exceeds 170, ensuring excellent heat transfer and rapid heat dissipation for stable operating temperatures; Manufactured with Direct Plating Copper technology, offering precise circuit patterns and vertical… Please enable JavaScript in your browser to complete this form.Please enable JavaScript in your browser to complete this form.Nome *E-mail *TelefonoProduct InquiryInvia Please create Inquiry form e add Related Shortcode.
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