High Performance Semiconductor Beryllium Beo Ceramic Disc Plate High Performance BeO Ceramic Plate with Excellent Thermal Conductivity for Semiconductor & Electronic Devices Beryllium Oxide Ceramic Beryllium oxide (BeO) ceramic is a high-performance advanced material known for its exceptional thermal conductivity and stability at high temperatures. It has a melting point ranging from 2530°C to 2570°C …

Al2O3 Ceramic Piston and Plunger Set – High Strength & Chemical Resistance for Pumps Wear and Corrosion Resistant Al2o3 Alumina Ceramic Piston Plunger Bushing Rod for High Pressure Pump Features of ceramic: 1. Refractory, High Temperature Resistance, Maximum Used Temperature: 1800 ºC (3272ºF)… 2. Hardness Strength Up To Mohs 9.0; HRA 80-90, Wear Resistance wear …

High-Purity Alumina Ceramic Disc for 1/2″–3/4″ Brass Tap Cartridges and Valves – Wear Resistant Attributes Details Material Alumina Ceramic (Alumina ceramics，95%–99%) Place of Origin Guangdong, China Type Ceramic Parts Application Industrial Ceramic / Valve Core / Tap Ceramic Disc Model Number XTL Brand Name GIM Processing Service Punching / OEM Service Available Color Pure …

Customized High Thermal Conductivity Aluminum Nitride (Aln) Ceramic Substrate Product Highlights Aluminum nitride (Aln) ceramic substrate is a next-generation material known for its exceptional thermal conductivity and excellent insulation properties. With the rising demand for efficient thermal management in high-power and high-density electronic applications, AlN has become a preferred choice for advanced LED packaging, large-scale …

Rame a legame diretto (DBC) Alumina Ceramic Substrate Product Description Warning/Disclaimer This product has obtained relevant product qualifications/licenses for certain applicable countries. Products Description DBC ceramic substrate DBC ceramic substrate is a high-performance material used in power electronics. It combines direct bonded copper (DBC) with a ceramic base, offering excellent thermal conductivity and electrical insulation. This …

High Precision Aluminum Nitride DPC Ceramic SubstrateProduct Specifications: Material: Aluminum Nitride Ceramic Thickness: 0.38 mm Graphic Tolerance: ±0.03 mm Product Size: 109.2×54.5 mm Tolerance: ±0.05 Warp: 0.003 mm/mm Key Highlights: Direct Plating Copper technology ensures high-precision graphic patterns and vertical circuit interconnections, ideal for dense packaging in optical communication devices; Exceptional thermal conductivity aids rapid …

AlN DPC Ceramic Substrate with High Thermal Conductivity Product Specifications: Material: Aluminum Nitride Ceramic Thickness: 0.38 mm Graphic Tolerance: ±0.03 mm Product Size: 109.2×54.5 mm Tolerance: ±0.05 Warp: 0.003 mm/mm Key Features: Ceramic thermal conductivity exceeds 170, ensuring excellent heat transfer and rapid heat dissipation for stable operating temperatures; Manufactured with Direct Plating Copper technology, …

High-Reliability DBC Ceramic Substrate for Packaging Product Specifications: Material: Alumina ceramic / ZTA Thickness: 0.32 / 0.635 mm Graphic Tolerance: ±0.03 mm Product Size: 109.2×54.5 mm Peel Strength: >5 N/mm Insulation Strength: >15K Product Advantages: Employs advanced direct bonding copper technology to ensure a seamless union between copper and ceramic, delivering outstanding durability and stability. …

Rame a legame diretto (DBC) Ceramic Substrate Product Specifications: Material: Alumina ceramic / ZTA Thickness: 0.32 / 0.635 mm Graphic Tolerance: ±0.03 mm Product Size: 109.2×54.5 mm Peel Strength: >5 N/mm Insulation Strength: >15K Key Features: Utilizes direct bonding copper technology to achieve a robust chemical bond between copper and ceramic, thereby enhancing thermal conductivity and …

Driver IGBT - Alta efficienza, Spina di controllo intelligente & Gioca · Ampia compatibilità · I nostri driver IGBT plug-and-play sono progettati per una perfetta integrazione con vari moduli IGBT ad alta potenza e alta tensione. Sia per pacchetti di moduli di alimentazione standard che personalizzati, Forniamo soluzioni di guida su misura per soddisfare le diverse esigenze applicative. Caratteristiche ✅ principali Spina & …

FRD/SBD Modules – High-Efficiency Rectification, Stable and Reliable High Voltage Tolerance · Low Leakage Current · Low Resistance · High Current Capacity FRD (Fast Recovery Diode) and SBD (Schottky Barrier Diode) modules offer high voltage tolerance, low leakage current, low forward resistance, and high current capability, making them essential for switching power supplies, PWM pulse …

SiC MOSFET Modules – High-Performance Silicon Carbide Power Solutions Enhanced Efficiency · Reduced Losses · Superior Reliability Our 650V-1700V industrial-grade and automotive-grade SiC power modules are designed for high-efficiency power conversion, widely used in renewable energy, smart grids, veicoli elettrici (Veicoli elettrici), Automazione industriale, and more. Key Advantages ✅ Low-inductance packaging design – Improves switching performance, …