High Precision Aluminum Nitride DPC Ceramic SubstrateProduct Specifications: Material: Aluminum Nitride Ceramic Thickness: 0.38 mm Graphic Tolerance: ±0.03 mm Product Size: 109.2×54.5 mm Tolerance: ±0.05 Warp: 0.003 mm/mm Key Highlights: Direct Plating Copper technology ensures high-precision graphic patterns and vertical circuit interconnections, ideal for dense packaging in optical communication devices; Exceptional thermal conductivity aids rapid …

High Thermal Conductivity Aluminum Nitride DPC Ceramic SubstrateProduct Specifications: Material: Aluminum Nitride Ceramic Thickness: 0.38 mm Graphic Tolerance: ±0.03 mm Product Size: 109.2×54.5 mm Tolerance: ±0.05 Warp: 0.003 mm/mm Key Features: Ceramic thermal conductivity exceeds 170, ensuring excellent heat transfer and rapid heat dissipation for stable operating temperatures; Manufactured with Direct Plating Copper technology, offering …

High-Reliability DBC Ceramic Substrate for Packaging Product Specifications: Material: Alumina ceramic / ZTA Thickness: 0.32 / 0.635 mm Graphic Tolerance: ±0.03 mm Product Size: 109.2×54.5 mm Peel Strength: >5 N/mm Insulation Strength: >15K Product Advantages: Employs advanced direct bonding copper technology to ensure a seamless union between copper and ceramic, delivering outstanding durability and stability. …

Product Specifications: Material: Alumina ceramic / ZTA Thickness: 0.32 / 0.635 mm Graphic Tolerance: ±0.03 mm Product Size: 109.2×54.5 mm Peel Strength: >5 N/mm Insulation Strength: >15K Key Features: Utilizes direct bonding copper technology to achieve a robust chemical bond between copper and ceramic, thereby enhancing thermal conductivity and structural stability. Alumina ceramic offers high …

Driver IGBT - Alta efficienza, Spina di controllo intelligente & Gioca · Ampia compatibilità · I nostri driver IGBT plug-and-play sono progettati per una perfetta integrazione con vari moduli IGBT ad alta potenza e alta tensione. Sia per pacchetti di moduli di alimentazione standard che personalizzati, Forniamo soluzioni di guida su misura per soddisfare le diverse esigenze applicative. Caratteristiche ✅ principali Spina & …

FRD/SBD Modules – High-Efficiency Rectification, Stable and Reliable High Voltage Tolerance · Low Leakage Current · Low Resistance · High Current Capacity FRD (Fast Recovery Diode) and SBD (Schottky Barrier Diode) modules offer high voltage tolerance, low leakage current, low forward resistance, and high current capability, making them essential for switching power supplies, PWM pulse …

SiC MOSFET Modules – High-Performance Silicon Carbide Power Solutions Enhanced Efficiency · Reduced Losses · Superior Reliability Our 650V-1700V industrial-grade and automotive-grade SiC power modules are designed for high-efficiency power conversion, widely used in renewable energy, smart grids, veicoli elettrici (Veicoli elettrici), Automazione industriale, and more. Key Advantages ✅ Low-inductance packaging design – Improves switching performance, …

SiC Schottky Diodes – High Efficiency & Reliability Product Overview Our SiC Schottky Diodes offer a voltage range of 650V to 1200V with a full current spectrum, delivering industry-leading performance. Recognized at an international level, our diodes are now being mass-produced and widely adopted in China. Key Features ✅ Positive Temperature Coefficient – Enables easy …

SiC MOSFET Series Product introduction Successfully developed a series of SiC MOS products under the 1200Vvoltage platform,the performance of which has reached the interna-tional level, and has been suppling in batches. Product features High blocking voltage, ultra-low on-resistance, low capacitance and high-speed switching, less affected by switching loss temperature, extremely low internal reverse recovery charge, …

  SiC Power Device Fabrication Process Flow ‌ 1. Substrate Preparation‌ ‌Core Objective‌: Obtain high-purity, low-defect SiC single-crystal substrates. ‌Crystal Growth‌: SiC powder is sublimated and deposited on a seed crystal via the Physical Vapor Transport (PVT) method at >2000°C, forming a SiC ingot‌. ‌Wafer Processing‌: Cutting: Diamond wire saws slice the ingot …

Personalizzazione della ceramica di precisione AMB: Materiali ad alte prestazioni, Soluzioni su misura Nel campo dell'alta tecnologia e dell'ingegneria di precisione, La selezione dei materiali è fondamentale. AMB (Brasatura attiva dei metalli) La ceramica si distingue come materiale ad alte prestazioni, rinomati per la loro eccezionale conducibilità termica, Isolamento elettrico, e resistenza meccanica, il che li rende la scelta preferita per numerose applicazioni avanzate. Our AMB precision …

  DBC Ceramic Customization: Superior Performance, Soluzioni su misura Nel campo dell'alta tecnologia e dell'ingegneria di precisione, La selezione dei materiali è fondamentale. DBC (Rame a legame diretto) ceramics stand out as a high-performance material, rinomati per la loro eccezionale conducibilità termica, Isolamento elettrico, e resistenza meccanica, il che li rende la scelta preferita per numerose applicazioni avanzate. Our DBC …