High Thermal Conductivity Aluminum Nitride DPC Ceramic Substrate

High Thermal Conductivity Aluminum Nitride DPC Ceramic Substrate
Product Specifications:

• • • Matériel: Aluminum Nitride Ceramic

    • Épaisseur: 0.38 mm

    • Graphic Tolerance: ±0.03 mm

    • Product Size: 109.2×54.5 mm

    • Tolérance: 0,05 ±

    • Chaîne: 0.003 mm/mm

Key Features:

• • • Ceramic thermal conductivity exceeds 170, ensuring excellent heat transfer and rapid heat dissipation for stable operating temperatures;

    • Manufactured with Direct Plating Copper technology, offering precise circuit patterns and vertical interconnections;

    • High electrical insulation and a thermal expansion coefficient closely matching that of silicon enhance overall system reliability.

Application Areas:

• • • LED lighting and display devices

    • Laser systems and optical communication equipment

    • Laser radar and high-temperature applications

Keywords: Aluminum Nitride Ceramic Substrate, DPC Substrate, Placage direct du cuivre, conductivité thermique élevée, LED substrate, laser substrate