GreenIM™Advanced Alumina Substrates | High Performance Ceramic Materials

What is GreenIM™ Alumina Substrate?

GreenIM™ alumina substrates are advanced ceramic materials designed for semiconductor, electronics, and high-power applications. With excellent thermal conductivity, dielectric strength, and mechanical stability, GreenIM™ offers reliable performance in demanding environments.

Compared with conventional Al₂O₃ ceramic substrates, GreenIM™ ensures superior electrical insulation, low dielectric loss, and exceptional surface quality, making it an ideal choice for next-generation electronic packaging.

Key Features of GreenIM™ Substrates

• High Purity Alumina (≥ 99.6%) – ensures consistent electrical and thermal performance.

• Excellent Thermal Conductivity – ideal for heat dissipation in high-power devices.

• High Dielectric Strength – reliable insulation for semiconductor circuits.

• Outstanding Mechanical Properties – high strength and resistance to wear and corrosion.

• Precision Surface Finish – compatible with thin film, thick film, and metallization processes.

Applications of GreenIM™ Alumina Substrates

GreenIM™ substrates are widely used across industries that require high precision and reliability:

• Semiconductor packaging – IC substrates, power modules, and LED packaging.

• High-frequency electronics – microwave devices, 5G la communication, and RF modules.

• Automotive electronics – EV power control units and high-voltage insulation.

• Aerospace & defense – radar systems, sensors, and avionics.

• Medical devices – implantable electronics and diagnostic instruments.

Explore more advanced ceramic applications

GreenIM™ vs. Other Ceramic Substrates

For applications requiring high thermal conductivity, AlN substrates may be recommended, while Si₃N₄ substrates provide higher mechanical toughness. Toutefois, GreenIM™ substrates balance cost, reliability, and performance, making them suitable for most industrial and electronic applications.

Why Choose Accuratus GreenIM™?

Accuratus has decades of experience in advanced ceramic material development. With precision manufacturing, ISO-certified processes, and global technical support, GreenIM™ substrates deliver unmatched consistency and reliability.

• Customized sizes and thicknesses available

• Compatible with DBC (Cuivre à liaison directe) and DPC (Direct Plated Copper) metallization

• Proven track record in semiconductor and electronics industries

Learn more about ceramic materials

• • The American Ceramic Society, ACerS)
    👉 https://ceramics.org/

  • Materials Project – Alumina Database (Lawrence Berkeley National Laboratory)
    👉 https://materialsproject.org/materials/mp-1143/

  • NASA Technical Reports – Ceramic Substrates in Electronics
    👉 https://ntrs.nasa.gov/

  • IEEE Xplore Digital Library (Électronique & Substrate Research)
    👉 https://ieeexplore.ieee.org/

  • AZoM – Alumina (Aluminum Oxide) Material Information
    👉 https://www.azom.com/article.aspx?ArticleID=52

Conclusion

GreenIM™ alumina substrates provide the perfect balance of cost-effectiveness, thermal performance, and dielectric reliability. Whether used in semiconductor packaging, RF communication, or power electronics, GreenIM™ delivers a trusted solution for advanced applications.

Contactez-nous
👉Website: nmmech.com
👉Email: jack@nmmech.com