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Sustrato cerámico DBC – Tecnología de cobre de unión directa

Sustrato cerámico DBC – Tecnología de cobre de unión directa

Product Specifications: Material: Alumina ceramic / ZTA Thickness: 0.32 / 0.635 mm Graphic Tolerance: ±0.03 mm Product Size: 109.2×54.5 mm Peel Strength: >5 N/mm Insulation Strength: >15K Key Features: Utilizes direct bonding copper technology to achieve a robust chemical bond between copper and ceramic, thereby enhancing thermal conductivity and structural stability. Alumina ceramic offers high thermal conductivity, excellent insulation, Alta resistencia mecánica, and a low thermal expansion coefficient. Coupled with the superior conductivity and welding performance of oxygen-free copper, it allows precise etching of PCB graphics and exceptional current carrying capacity. Designed for semiconductor packaging and IGBT modules, this product excels in aerospace, communication cooling systems, industrial control, as well as emerging applications in new energy vehicles and photovoltaic power…

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Product Specifications:

      • Material: Alumina ceramic / ZTA

      • Espesor: 0.32 / 0.635 milímetro

      • Graphic Tolerance: ±0.03 mm

      • Product Size: 109.2×54.5 mm

      • Peel Strength: >5 N/mm

      • Insulation Strength: >15K

Key Features:

      • Utilizes direct bonding copper technology to achieve a robust chemical bond between copper and ceramic, thereby enhancing thermal conductivity and structural stability.

      • Alumina ceramic offers high thermal conductivity, excellent insulation, Alta resistencia mecánica, and a low thermal expansion coefficient. Coupled with the superior conductivity and welding performance of oxygen-free copper, it allows precise etching of PCB graphics and exceptional current carrying capacity.

      • Designed for semiconductor packaging and IGBT modules, this product excels in aerospace, communication cooling systems, industrial control, as well as emerging applications in new energy vehicles and photovoltaic power generation.

Application Areas:

      • Semiconductor cooling components, aerospace equipment, and communication heat dissipation systems

      • High-speed rail, Vehículos de nueva energía, photovoltaic power, and industrial control

Keywords: Sustrato cerámico DBC, Cobre de unión directa, alumina ceramic, ZTA, PCB etching, semiconductor packaging, high thermal conductivity, Alto aislamiento

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