Sustrato cerámico DPC cerámico de nitruro de aluminio (cobre de revestimiento directo)

Aluminum nitride ceramic DPC ceramic substrate Direct Plating Copper Material: aluminum nitride ceramic Thickness: 0.38 Tolerancia gráfica: ±0.03 Tamaño del producto: 109.2*54.5mm Tolerance: ±0.05 Warp (milímetro): 0.003/mm Features: Ceramic thermal conductivity>170, with good thermal conductivity/heat resistance, high graphic accuracy, vertical circuit interconnection and other technical advantages, high electrical insulation, close to the thermal expansion coefficient of silicon Application areas: LED, laser, optical communication, laser radar

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Detalles del producto

Sustrato cerámico DPC cerámico de nitruro de aluminio
Direct Plating Copper

Material: aluminum nitride ceramic
Espesor: 0.38
Tolerancia gráfica: ±0.03
Tamaño del producto: 109.2*54.5milímetro
Tolerance: ±0.05
Warp (milímetro): 0.003/milímetro
Funciones: Ceramic thermal conductivity>170, with good thermal conductivity/heat resistance, high graphic accuracy, vertical circuit interconnection and other technical advantages, high electrical insulation, close to the thermal expansion coefficient of silicon
Ámbitos de aplicación: LED, laser, optical communication, laser radar