High-Reliability DBC Ceramic Substrate for Packaging

High-Reliability DBC Ceramic Substrate for Packaging

Product Specifications:

• • • Material: Alumina ceramic / ZTA

    • Dicke: 0.32 / 0.635 Mm

    • Graphic Tolerance: ±0.03 mm

    • Product Size: 109.2×54.5 mm

    • Peel Strength: >5 N/mm

    • Insulation Strength: >15K

Product Advantages:

• • • Employs advanced direct bonding copper technology to ensure a seamless union between copper and ceramic, delivering outstanding durability and stability.

    • Superior material properties of alumina and ZTA offer excellent resistance against thermal shock, making the substrate ideal for harsh operational environments.

    • Widely used in high-reliability semiconductor packaging, IGBT modules, and other critical electronic components.

Anwendungsbereiche:

• • • Industrial automation, Luft- und Raumfahrt, und Kommunikationsgeräte

    • High-speed rail and new energy vehicle systems

Keywords: DBC packaging substrate, high reliability, thermal shock resistance, industrial electronics, copper-ceramic bonding, IGBT module