Aluminum nitride ceramic DPC ceramic substrate（Direct Plating Copper）

Aluminum nitride ceramic DPC ceramic substrate Direct Plating Copper Material: aluminum nitride ceramic Thickness: 0.38 Grafische Toleranz: ±0.03 Produktgröße: 109.2*54.5mm Tolerance: ±0.05 Warp (Mm): 0.003/mm Features: Ceramic thermal conductivity>170, with good thermal conductivity/heat resistance, high graphic accuracy, vertical circuit interconnection and other technical advantages, high electrical insulation, close to the thermal expansion coefficient of silicon Application areas: LED, Laser, Optische Kommunikation, laser radar

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Produktdetails

Aluminiumnitrid-Keramik-DPC-Keramiksubstrat
Direct Plating Copper

Material: aluminum nitride ceramic
Dicke: 0.38
Grafische Toleranz: ±0,03
Produktgröße: 109.2*54.5Mm
Tolerance: ±0.05
Warp (Mm): 0.003/Mm
Funktionen: Ceramic thermal conductivity>170, with good thermal conductivity/heat resistance, high graphic accuracy, vertical circuit interconnection and other technical advantages, high electrical insulation, close to the thermal expansion coefficient of silicon
Anwendungsbereiche: LED, Laser, Optische Kommunikation, laser radar