If you have questions about our products, Fill out the form below and we will answer any questions you have. Tips: Fields marked with*are required. AlN DPC Ceramic Substrate with High Thermal ConductivityAlN DPC Ceramic Substrate with High Thermal Conductivity Product Specifications: Material: Aluminum Nitride Ceramic Thickness: 0.38 mm Graphic Tolerance: ±0.03 mm Product Size: 109.2×54.5 mm Tolerance: ±0.05 Warp: 0.003 mm/mm Key Features: Ceramic thermal conductivity exceeds 170, ensuring excellent heat transfer and rapid heat dissipation for stable operating temperatures; Manufactured with Direct Plating Copper technology, offering precise circuit patterns and… Please enable JavaScript in your browser to complete this form.Please enable JavaScript in your browser to complete this form.Name *E-Mail *TelefonProduct InquirySenden Please create Inquiry form und add Related Shortcode.
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