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Aluminum nitride ceramic DPC ceramic substrate（Direct Plating Copper）

Aluminum nitride ceramic DPC ceramic substrate（Direct Plating Copper）

DBC ceramic substrate customization

Anpassung von DBC-Keramiksubstraten

IGBT Drivers – High Efficiency, Intelligent Control

IGBT Drivers – High Efficiency, Intelligent Control

SiC Power Device Manufacturing Process

Herstellungsprozess für SiC-Leistungsbauelemente

High Precision Aluminum Nitride DPC Ceramic Substrate

High Precision Aluminum Nitride DPC Ceramic Substrate

FRD Power Module Series

FRD Power Module Series

SiC MOSFET Power Solution Series

SiC MOSFET Power Solution Series

IGBT Power Module Series

IGBT Power Module Series

SiC SBD High-Efficiency Series

SiC SBD High-Efficiency Series

DBC Ceramic Substrate – Direct Bonding Copper Technology

DBC Ceramic Substrate – Direct Bonding Copper Technology

High-Reliability DBC Ceramic Substrate for Packaging

High-Reliability DBC Ceramic Substrate for Packaging

High Thermal Conductivity Aluminum Nitride DPC Ceramic Substrate

High Thermal Conductivity Aluminum Nitride DPC Ceramic Substrate