جيم
الموصلية الحرارية العالية LED الركيزة
LED aluminum nitride gold-plated substrate：
using DPC process to electroplate the conductive line on the aluminum nitride substrate,
the coating is Ti-Cu-Ni-Pd-Au, with excellent conductivity and heat dissipation, used in LED chip packaging.
LED aluminum oxide silver-plated substrate：
using DPC process to electroplate the conductive line on the aluminum oxide substrate,
the coating is Ti-Cu-Ag, with excellent conductivity and heat dissipation, used in LED chip packaging.
